PIPages
Labs

Rashmi Jha

University of Cincinnati, OH·Engineering

Phones, computers and AI hardware depend on non-volatile memory (NVM), which keeps data without power. Future data demands may need storage a thousand times denser than today's chips.

Fields

Engineering

Materials Science

Computer Science

Topics

non-volatile memory

DNA data storage

synthetic DNA

Grants
1 known grant, through Jul 2027

What they work on

  1. Model, design and synthesize specific synthetic DNA sequences, varying base pairs, sequence, length and crystallinity, for integration with organometallic halide perovskite semiconductors.
  2. Develop and characterize hybrid perovskite-DNA biomaterials to learn how DNA and the semiconductor interact electrically and optically to produce multiple memory states.
  3. Build high-density perovskite-DNA non-volatile memory arrays, integrate them with optoelectronic systems and CMOS back-end-of-line circuits, and demonstrate data storage and in-memory computing.

More about the research

Synthetic DNA is the densest known storage medium and can preserve information for very long times, but reading and writing it chemically is costly, error-prone, about a million times slower than silicon memory, and incompatible with standard CMOS (complementary metal-oxide-semiconductor) chips. This project asks whether DNA can instead serve as part of an electronic device built on ordinary chip technology.

Why it matters

Hybrid DNA-semiconductor memory could make data storage far denser than current chips while keeping it compatible with standard CMOS manufacturing. That could help the electronics industry meet growing storage needs and speed up artificial intelligence and machine learning hardware through in-memory computing.

Known grants

From NIH and NSF research grants. Labs often have other funding we can't see.

SemiSynBio-III: Novel Memory Devices for High-Density Data Storage and In-Memory Computing Based on Integrated Synthetic DNA-Semiconductors

NSF · Aug 2022 – Jul 2027

Closest labs

Raisul Islam

Purdue University, IN·Engineering

Fabricate and characterize the Diffusive Ferroelectric Field-Effect Transistor (DFeFET), combining engineered drain contact metals with amorphous oxide semiconductor channels in a ferroelectric-gated transistor to obtain controllable volatile hysteresis in drain current-voltage curves.

Sarah Swisher

University of Minnesota, MN·Engineering·Early-career

Create a vertical ferroelectric memcapacitor, a capacitor that stores memory states, that can be fabricated in the back end of the CMOS process for monolithic 3D chip integration.

Jing Zhang

Rochester Institute of Technology, NY·Engineering

Advance interdisciplinary semiconductor research in four tracks spanning physics and materials science, micro- and nanoelectronics, optoelectronics and photonics, and integrated circuits and packaging, all built on CMOS chip technology.

The school

University of Cincinnati: 18 labs on PI Pages, $740M a year on research, 275 research doctorates a year.

More about University of Cincinnati

Reach out

A start for your email. Fill in the brackets.